2025 Best paper award

Scan Test for 99% Defect Coverage of R-2R DACs

Stephen Sunter and Krzysztof Jurga, Siemens Digital Industries Software

Honorable mention

Fault Modeling and Testing of Chiplet-to-Chiplet Interconnects in Fan-out Wafer-Level Packaging

Partho Bhoumik∗, Arjun Chaudhuri∗, Sandeep Kumar Goel‡ and Krishnendu Chakrabarty∗,  *Arizona State University   ‡TSMC

LA-DOS: Layout-Aware-Defect-Oriented Stress UDFM & ATPG Pattern Generation for Zero Defect Automotive Designs

Mohammed Zine E. Brahmi*, Jennifer Dworak*, Martina Perkovic*, Megan Appel*, Saidapet Ramesh‡, Ravi J N‡, Ramanath Dharmavarm‡, Arun Kumar Anjaneyareddy‡ and Chen He‡,   *Southern Methodist University   ‡NXP