Air Force Supply Chain Provenance Challenge

AFWERX CHALLENGE at International Test Conference, November 12-14, 2019

AFRL and AFWERX have partnered to launch the Supply Chain Provenance Challenge geared around demonstrating solutions that help solve the current microelectronic supply chain problem. The challenge is attempting to identify solutions that are non-destructive in nature and prove provenance and suitability for military use of microelectronic parts in commercial off the shelf hardware to be used on base installations or in operation.

Attend this special event on the ITC Exhibit floor, booths 509, 511, & 513.


There are three participant teams

  2. Brunel University London, Supply Dynamics
  3. Object Security, Riverside Research





Sponsored by:

Air Force Research Lab (AFRL), Under Secretary of Defence for Research and Engineering, Cisco, & Nvidia

Global Test Forum

As part of its 50th anniversary celebration, ITC is proud to announce a unique and informative venue: The ITC Global Test Forum (GTF), which honors the geographic breadth of the test community and highlights the global reach of ITC during the past 50 years.

This Forum features contributions of prominent test technology related conferences and workshops established around the globe in the past 50 years. This Forum will be held as a special village at the 50th ITC Atrium just outside the exhibition hall. It consists of a circular set of stands/booth representing the participating conferences. Each participating conference will be assigned a dedicated stand/booth with a large monitor, to be used for an interactive presentation about their conference, covering the past achievements, present activities and future opportunities.

In addition to the interactive presentation, each conference will be requested to publish a 4‐page paper about the corresponding conference covering past, present and future. Each conference could be represented by delegates.

On Tuesday, Nov. 12 at 2pm, the GTF unveiling ribbon cutting ceremony will take place to start interactive presentations. As the exclusive GTF supporter, the Chinese Academy of Sciences has kindly agreed to contribute towards the realization of this special GTF village.

ITC Receptions and Social Events

ITC provides many opportunities to interact and connect with others during the week.  In addition to the program breaks, plan to attend the various social events throughout the week for prime networking time with colleagues.

ITC 50th Year Celebration Tuesday, November 12

Join the party on Tuesday, November 12, from 6:30-8:30PM as we commemorate and celebrate 50 years of ITC and transform the Marriott Ballroom into a futuristic fantasyland.   Food and beverage for all registered attendees and exhibitors, with entertainment and networking opportunities to connect with your colleagues.   Sponsorships available. Click here for more information.

Post Panel Reception Monday, November 11

Following our “ITC VC Pitch Tank” panel on Monday afternoon, stick around for a reception to carry on the lively discussion.  Meet us in the Marriott Foyer for some networking over libations and hors d’oeuvres.

Workshop Reception Thursday, November 14

For those registered for TTTC Workshops at the close of ITC, we have a special treat in store for you.  Following Thursday afternoon’s registration and welcome, head on up to the Wilson Rooms on the Mezzanine Level for your private evening reception.

ITC 2019 Posters

ITC 2019 is pleased to present over fifty posters covering new research and industrial practices in test.  The poster session presents a unique opportunity for presenters and attendees to engage one-on-one in in-depth discussions of subjects that range from practical case studies to the first look at cutting edge “works in progress.”

Topics of this year’s session encompass all areas of test—from advances in ATE and Board Test, to Test Standards, to on-die test and DFT circuitry, to the use of machine learning and artificial intelligence in test.  Test for automotive and safety-critical devices is well-represented, along with test specifically focused on RF, Analog, and Mixed-Signal devices.

No matter your interests or background, the ITC poster session is a great chance to ask questions, learn new test methods and applications, and make new connections with colleagues.


ATE, Board Test, and FPGA-based Test

  • “Challenges in Industrializing high integration devices (CPU/FPGA) that has very large digital test content with EOL exceeding 25 years,” Vinayaka Lg and Prashanth Kudva
  • “Utilizing FPGA as Synthetic Instruments for Test Reuse,” TM Mak, Neil Jacobson and Louis Ungar
  • “Industrial Practices – Short Paper: Dynamic Temperature Range test and validation strategy for embedded designs and IP blocks,” Tudor Secasiu, Nancy Wang-Lee and Jihad Abbas
  • “In Test Flow Neural Network Inference on the V93000 SmarTest Test Cell Controller,” Makoto Eiki, Keith Schaub, Ira Leventhal and Brian Buras
  • “CloudTestingTm Service Enables Board Level Post Silicon Debug,” Reju Radhakrishnan, Alok Kashyap, Satish Panigatti, Yasuji Oyama and At Sivaram
  • “New FPGA Firmware for Multi-Para Probe Card Relay,” Kisub Lim
  • “High-Volume Consumer Devices Need High-Voltage Test Solution,” Anthony Lum, Bin Wang, Rohit Waikar and At Sivaram
  • Characteristics of Ring Oscillators Considering FPGA structure,” Yukiya Miura and Kouhei Sato



  • PS-XLBIST: Per-Shift X-Tolerant Logic BIST,” Peter Wohl, John Waicukauski and Frederic Neuveux
  • A novel PRPG streaming scan test optimized for failure analysis of field returns,” Shinobu Okanishi, Kazuki Shigeta, Satoshi Tanaka, Hiroyuki Osawa, Ric Dokken and Hiroshi Yanagita
  • “A DFT Scheme for Fault Monitoring in STT-MRAMs,” Govind Radhakrishnan, Youngki Yoon and Manoj Sachdev
  • “Custom Point Tooling for ASIC DFT Structural Checking & Test Deliverables,” Douglas Sprague, Howard Druckerman and Chris Le Coz
  • “Optimized Memory BIST solution for testing CAMs,” Dongkwan Han, Yoseop Lim, Benoit Nadeau-Dostie, Etienne Racine and Raghav Mehta
  • “High-Performance Memory BIST Solution for Testing HBM DRAMs,” Dongkwan Han, Hyeonuk Son, Etienne Racine, Raghav Mehta and Harshitha Kodali
  • `On-Chip Test Decompression and Compaction for EDT using Neural Networks,” Philemon Daniel, Aakash Tyagi, Shaily Singh, Garima Gill, Anshu Singh Gangwar, Ganesh Bargaje and Kaushik Chakrabarti
  • “Running In-System MBIST by reusing ATE MBIST tests,” Weili Wang
  • “Performance Analysis and Optimization of Reconfigurable Scan Network Architecture”, Jan Burchard, Reinhard Meier, Stephan Eggersglüß


Hierarchical Test and Test Standards

  • “Direct Application of IEEE 1450.4 Test Flow on ATE,” Ric Dokken
  • “Internal I/O Testing: Definition, Solution and a Case Study,” Sreejit Chakravarty, Fei Su, Indira A Gohad, Sudheer B Bandana, B S Adithya and Wei-Ming Lim
  • “Novel IEEE 1687-Like Architectures,” Michael Laisne
  • “IEEE P2654 System Test Access Management,” Jan Schat, Heiko Ehrenberg, Bradford van Treuren and Ian McIntosh
  • “Hierarchical DFT Flow mixed with a Traditional DFT Flow,” Jeongmi Kwon, Ron Press, Dongkwan Han and Juhee Han
  • “Efficient Specifications, Implementation & Tracking of IJTAG (IEEE1687) TDRs,” Chandra Nalage and Vidya Neerkundar
  • “Hierarchical Test with TAP based Silicon Defect Screening,” Satish Panigatti, Rahul Singhal, Varun Rajagopal and Knut Mellenthin
  • “IJTAG (IEEE 1687) Evolution Status,” Jim Johnson, Alfred Crouch and Bill Atwell


High Quality Test, Safety, and Yield

  • “Machine Learning Driven Throughput Optimization of Volume Diagnosis Methodology,” Robert Redburn, Sameer Chillarige, Nicholai L’Esperance, Jeff Zimmerman, Adisun Wheelock, Anil Malik, Martin Amodeo, Atul Chhabra and Bharath Nandakumar
  • “Overcoming Challenges in Maximizing Yield with Memory Repair,” Praveen Raghuraman, Vaishnavi Sundaralingam and Bharath Vojjala
  • “Framework for Efficient Software Test Library Development for Embedded Core with ASIL-B/SIL-2 Target,” Ashish Vanjari, Bharat Rajaram and Salvatore Pezzino
  • “Anatomy of an in-die tester to improve Safety, Infant Mortality and System Availability,” Sreejit Chakravarty, E Brazil, Rakesh Kandula, Neel Shah, V. R. Sarath, Rajeev Katta, A Karthika and Veeresha Bevinamatti
  • “DfT and Functional Safety – often friends, but sometimes rivals,” Jan Schat, Robert Jin, Lei Ma and Andres Barrilado
  • “Wafer Level Stress – Enabling Zero Defect for Automotive Microcontrollers without Package Burn-In,” Chen He and Yanyao Yu
  • “Driving Towards Zero Defects in the Next Generation Automotive Markets,” Stephen Traynor
  • “How use of guardband limits effects production quality in automotive segment and at which cost,” Gianluca Basile and Chuck Carline


Machine Learning, Simulation, and Modeling

  • “A Comparsion of ML Categorization Techniques for Test Datalogs,” Lawrence Luce
  • “UltraFlex AI chip final test design and challenge: A case study,” Steve Huang, Ci Kuo, Cheng-Cheng Chen and Stockton Chiang
  • “Deep Learning Based Test Compression Analyzer,” Cheng-Hung Wu, Yu Huang, Kuen-Jong Lee, Wu-Tung Cheng, Gaurav Veda, Sudhakar Reddy, Chun-Cheng Hu and Chong-Siao Ye
  • “On Scalable GPU-based Parallel Logic Simulation,” Liyang Lai, Qiting Zhang, Hans Tsai and Wu-Tung Cheng
  • “SAL: Function Search Attack On Logic Locked Circuits,” Yuqiao Zhang, Pinchen Cui, Ziqi Zhou and Ujjwal Guin
  • “Case Study on Test Strategy of an AI SoC,” Haiying Ma, Rui Guo, Quan Jing, Jing Han, Yu Huang, Rahul Singhal and Wu Yang
  • “Wire Length as a Function of Fan-Outs,” Kazuhio Iwasaki
  • “Applying Artificial Neural Networks to Test-point Insertion: Delay Fault Coverage and Training Circuit Generation,” Spencer Millican, Yang Sun, Soham Roy and Vishwani Agrawal
  • “Enabling DFT and Fast Silicon Bring-up for Massive AI Chip – Case Study”, Hui King Lau, Jon Ferguson, Evan Griffiths, Rahul Singhal, Lee Harrison


RF and Analog Test

  • “High Speed RFADC/RFDAC Test Challenges for ATE,” Kevin Fan
  • “Enhanced Limited Pin Test for Analog: “Towards IEEE1687 for Analog,” Mahmoud Abdalwahab, Tom Waayers and Willy Slendebroek
  • “Sense Amplifier Offset and Weak Cell Test Considerations for Low-Voltage SRAMs,” Derek Wright, Manoj Sachdev and Dhruv Patel
  • “Photovoltaic-Powered Contactless Scribe-Line Testing with VLC Downlink and IR-UWB Uplink,” Anıl Özdemirli, Ali Arda Yıldız and Uğur Çilingiroğlu
  • “Test item reduction using machine learning in RF semiconductor production,” Ahreum Lee and Taesup Moon
  • “An Effective INL Test Methodology For Low Sampling Rate and High Resolution Analog-to-Digital Converter,” Keno Sato, Takashi Ishida, Toshiyuki Okamoto, Tamotsu Ichikawa, Haruo Kobayashi, Kazumi Hatayama, Takayuki Nakatani, Anna Kuwana, Jiang-Lin Wei, Nene Kushita, Hirotaka Arai and Lei Sha
  • “Adaptive RF DIB Design for Bench and ATE,” Gowrishankar Ilankumaran, Srinivasan Chandrasekaran and Jagadish Chandrasekaran
  • “Multi-Site DUT to Tester Interfacing for mmWave Devices,” Michael Dewey, David Hu and Dale Johnson


VC funding opportunity at ITC 2019

Venture capital funding opportunity!

 For the first time in ITC, we bring together a number of  venture capitalists (VCs) to listen to your ideas and possibly invest. We invite startup companies, engineers, faculty, and students to pitch their ideas to the VCs and seek funds to help raise their company portfolio or start a new company. Any topics related to test, reliability, and hardware security is of high interests.

VC Panelists:

Serge Leef, DARPA
Jack Kerrigan, Razor’s Edge
Andrew McClure, Forgepoint Capital
Andy Bair, Sway Ventures
David Moehring, General Partner VC
Steven Chen, PFP Cyber
Rafic Makki, Abu Dhabi’s Mubadala Fund

If you would like to make a pitch, please contact Mark Tehranipoor ( and Shawn Blanton (, and provide a title, name of the presenter and an abstract no longer than 300 words. A committee will select about 8-10 ideas to be pitched to the VCs.

Submission due: Sep. 30, 2019

 This event is scheduled at 4:30pm on Monday Nov. 11, 2019. Note ITC 2019 is held in Washington DC. A reception follows at 6:30pm.


We also invite all ITC participants to attend presentations to the VCs, and join the reception.


4th Automotive Reliability and Test Workshop

Be part of a great forum of experts

The ART workshop focuses exclusively on test and reliability of automotive and mission-critical electronics, including design, manufacturing, burn-in, system-level integration and in-field test, diagnosis and repair solutions, as well as architectures and methods for reliable and safe operations under different environmental conditions. With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable operation of electronics in safety-critical domains is still a major challenge. The ART Workshop offers a forum to present and discuss these challenges and emerging solutions among researchers and practitioners alike.

ART will take place in conjunction with the IEEE International Test Conference (ITC) and is sponsored by the Test Technology Technical Council (TTTC) of IEEE Computer Society.

You are invited to participate and submit your contributions to the ART Workshop. The workshop’s areas of interest include (but are not limited to) the following topics:

  • Functional safety and security in the automotive domain
  • Automotive standards and certification – ISO 26262
  • Approximate computing and Artificial Intelligence
  • Multi-layer dependability evaluation
  • Verification and validation of automotive systems
  • Fault tolerance and self-checking circuits
  • Aging effects on automotive electronics
  • Resiliency by application
  • Dependability challenges of autonomous driving and e-mobility
  • Power-up, power-down and periodic test
  • System level test
  • Reuse of test infrastructure
  • Functional and structural test generation
  • High quality volume test- minimizing DPPM
  • Life cycle test cost minimization

Key Dates

Submission deadline September 10
Decision notification September 28
Camera-ready upload October 12

Contact us

For more information:

Yervant Zorian – General Chair –

Paolo Bernardi – Program Chair –

ITC 2019 in Washington, DC

Join us in 2019 for a special ITC 50 year celebration

Poster templates

The 2019 ITC call for papers submission site is open.  You can submit your posters through the easychair link.

There are templates and additional information available on the website program page “quick links” on the right of the page.

Poster submissions

Authors are  invited to submit a single-page poster proposal.  Here is a poster template and example.  Note that you submit the one-page extended poster abstract using the poster template.  Once accepted, then you prepare the poster itself for the conference.

  • Poster abstract submission deadline: June 15, 2019
  • Author notification: July 13, 2019



Introducing industrial short papers



ITC 2019 is encouraging authors from the industry to submit their most current and innovative work. To ease the burden of submission, an industrial practitioner can choose to submit as a regular paper or to a newly-created “short paper” category.

The short paper category is solely for industrial practitioners. If you elect to submit a short paper,

1. The first author and the speaker (if accepted) must be both from a company

2. The submission can be up to 4 pages long. Download the template here.

3. When submitting, please choose the track name: Industrial Practices – Short Paper


For questions on industrial practice short paper, contact

More information is also available on the ITC web site at




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2018 Plenary Awards


Awards presented in the 2018 ITC plenary. it includes the 2017 best paper award, Ned Kornfield award, TTTC lifetime contribution award, newly elevated IEEE fellows, Bob Madge Innovation award, and GW Gordon student participation award