Tuesday Plenary Keynote
Sr Fellow & co-GM, Intel
Title – On-Package Chiplet Innovations with Universal Chiplet Interconnect Express (UCIe): Challenges and Opportunities
Biography: Dr. Debendra Das Sharma is an Intel Senior Fellow and co-GM of Memory and I/O Technologies in the Data Platforms and Artificial Intelligence Group at Intel Corporation. He is a leading expert on I/O subsystem and interface architecture.
Dr. Das Sharma is a member of the Board of Directors for the PCI Special Interest Group (PCI-SIG) and a lead contributor to PCIe specifications since its inception. He is a co-inventor and founding member of the CXL consortium and co-leads the CXL Board Technical Task Force. He co-invented the chiplet interconnect standard UCIe and is the chair of the UCIe consortium.
Abstract: High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure such as co-packaged optics to meet the demands of the supercomputing landscape. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape.
Universal Chiplet Interconnect Express (UCIe), is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package; like the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express® and Compute Express Link (CXL)®. In this talk, we will discuss the usages and key metrics associated with different technology choices in UCIe and how it will evolve going forward. We will also delve into the challenges and opportunities for chiplets connected through UCIe, including test and debug.
Title: Delivering the Metaverse Vision with AI, AR/VR and Silicon Design Innovations
Caitlin Kalinowski (Head, AR Hardware)
Moderator: Savita Banerjee (Sr. Manager DFx)
Abstract: The Metaverse is the evolution of the mobile internet. It will revolutionize social connection, fuel creativity and create new business opportunities. In the past, meaningful connection and presence were limited by the available 2D platforms, such as laptops and phones, as well as the compute capabilities that muted the overall experience. Thanks to technological advances across several foundational areas and the release of disruptive devices that incorporate them, we are finally getting a glimpse of the Metaverse promise. This didn’t happen overnight and sustained innovations across multiple disciplines are still required. AI and AR/VR are essential ingredients of this ecosystem. These use cases amplify the need for a vertically optimized stack from software to silicon and open the door for unique problems in semiconductor design, test and manufacturability. Hear thought leaders at Meta discuss the state-of-the art in this arena and the challenges left to be solved.
Wednesday Visionary Talk
Sr VP & GM, Automotive Business, Arm
Title: Four Wheels and A Billion Lines of Code – Enabling the Future of Automotive
Biography: Dipti leads the organization responsible for delivering Arm-based solutions in the transformational opportunities of automotive.
Previously, Dipti served as Vice President and General Manager of the Product Management and Customer Enablement division in the IoT Group at Intel. Before that, Dipti held several leadership positions at Texas Instruments and led the creation of the company’s Sitara brand of Arm MPUs.
Abstract: The automotive industry is undergoing one of the most significant technology revolutions in human history, unleashed by the power of software. Vehicles of the future hold the potential to save millions of lives, help save the planet, and deliver enriching experiences that improve our quality of life. As future generations of vehicles adopt modern technologies and a rapid rise in
electronics, we must work together as an industry to enable this critical transformation.
In her keynote, Dipti will discuss the holistic approach required to deliver these vehicles of the future and the investments required in hardware, software, and industry collaborations to make this vision a reality.
CEO, CARIAD Inc
Title: Is it Safe to Pass? Challenges & Solutions to Healthy Vehicles
Biography: Scott Runner has more than 30 years of software, hardware, and semiconductor experience in the global automotive and mobile communications industries. He also has extensive leadership experience in digital and cultural transformation.