Tuesday Plenary Keynote

Debendra SharmaDr. Debendra Das Sharma

Sr Fellow & co-GM, Intel

Title – On-Package Chiplet Innovations with Universal Chiplet Interconnect Express (UCIe): Challenges and Opportunities

Biography:  Dr. Debendra Das Sharma is an Intel Senior Fellow and co-GM of Memory and I/O Technologies  in the Data Platforms and Artificial Intelligence Group at Intel Corporation. He is a leading expert on I/O subsystem and interface architecture.

Dr. Das Sharma is a member of the Board of Directors for the PCI Special Interest Group (PCI-SIG) and a lead contributor to PCIe specifications since its inception. He is a co-inventor and founding member of the CXL consortium and co-leads the CXL Board Technical Task Force. He co-invented the chiplet interconnect standard UCIe and is the chair of the UCIe consortium.

Dr. Das Sharma has a bachelor’s in technology (with honors) degree in Computer Science and Engineering from the Indian Institute of Technology, Kharagpur and a Ph.D. in Computer Engineering from the University of Massachusetts, Amherst.​ He holds 175 US patents and 450+ patents world-wide. He is a frequent keynote speaker, plenary speaker, distinguished lecturer, invited speaker, and panelist at the IEEE Hot Interconnects, IEEE Cool Chips, IEEE 3DIC, SNIA SDC, PCI-SIG Developers Conference, CXL consortium, Open Server Summit, Open Fabrics Alliance, Flash Memory Summit, Intel Innovation, various Universities (CMU, Texas A&M, Georgia Tech, UIUC, UC Irvine), and Intel Developer Forum. He has been awarded the Distinguished Alumnus Award from Indian Institute of Technology, Kharagpur in 2019, the IEEE Region 6 Outstanding Engineer Award in 2021, the first PCI-SIG Lifetime Contribution Award in 2022, and the IEEE Circuits and Systems Industrial Pioneer Award in 2022.

Abstract:  High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure such as co-packaged optics to meet the demands of the supercomputing landscape. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape.

Universal Chiplet Interconnect Express (UCIe), is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package; like the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express® and Compute Express Link (CXL)®. In this talk, we will discuss the usages and key metrics associated with different technology choices in UCIe and how it will evolve going forward. We will also delve into the challenges and opportunities for chiplets connected through UCIe, including test and debug.

Wednesday Keynote

Title: Delivering the Metaverse Vision with AI, AR/VR and Silicon Design Innovations

Meta Speakers

Caitlin Kalinowski (Head, AR Hardware)

Caitlin Kalinowski leads the AR Hardware team for Reality Labs at Meta. For the past seven years, she led VR Hardware, the division responsible for the Meta Quest 2 and Touch controllers, as well as the Oculus Rift. Before working at Oculus, Caitlin was a technical lead at Apple on the Mac Pro and MacBook Air products and was part of the original unibody MacBook Pro teams. Caitlin received her BS in Mechanical Engineering from Stanford University in 2007.

Manohar Paluri (Sr. Director, Generative AI)

Manohar Paluri is a senior director at Meta and leads an organization focusing on Generative Artificial Intelligence. His team is at the intersection of research and product and powers image and video understanding capabilities for hundreds of products across all of Meta’s family of apps serving Billions of people everyday.

Moderator: Savita Banerjee (Sr. Manager DFx)

Savita Banerjee leads DFX strategy for Augmented Reality products at Meta’s Reality Labs. She received her Ph.D. from the University of Massachusetts at Amherst and started her career at Bell Labs. Savita is recognized for her contributions to advancements in silicon technology for storage, networking, data centers and AR/VR applications. At Meta, she leads design for test strategy for the AR roadmap utilizing advanced process nodes with optimized flows to meet stringent product requirements. She is passionate about building disruptive technologies for next generation compute platforms that improve how we work, connect, and have fun.

Abstract:  The Metaverse is the evolution of the mobile internet. It will revolutionize social connection, fuel creativity and create new business opportunities. In the past, meaningful connection and presence were limited by the available 2D platforms, such as laptops and phones, as well as the compute capabilities that muted the overall experience.  Thanks to technological advances across several foundational areas and the release of disruptive devices that incorporate them, we are finally getting a glimpse of the Metaverse promise.  This didn’t happen overnight and sustained innovations across multiple disciplines are still required.  AI and AR/VR are essential ingredients of this ecosystem. These use cases amplify the need for a vertically optimized stack from software to silicon and open the door for unique problems in semiconductor design, test and manufacturability. Hear thought leaders at Meta discuss the state-of-the art in this arena and the challenges left to be solved.

 

Wednesday Visionary Talk

Dipti VachaniDipti Vachani

Sr VP & GM, Automotive Business, Arm

Title: Four Wheels and A Billion Lines of Code – Enabling the Future of Automotive

Biography:  Dipti leads the organization responsible for delivering Arm-based solutions in the transformational opportunities of automotive.

Previously, Dipti served as Vice President and General Manager of the Product Management and Customer Enablement division in the IoT Group at Intel. Before that, Dipti held several leadership positions at Texas Instruments and led the creation of the company’s Sitara brand of Arm MPUs.

Dipti is on the Women’s Leadership Council for the Global Semiconductor Association. She holds a BS in Computer Engineering from Texas A&M, an Executive MBA degree from the University of Texas, and is a graduate of the Executive Education programs at Stanford, Harvard, and Cambridge business schools.

Abstract: The automotive industry is undergoing one of the most significant technology revolutions in human history, unleashed by the power of software. Vehicles of the future hold the potential to save millions of lives, help save the planet, and deliver enriching experiences that improve our quality of life. As future generations of vehicles adopt modern technologies and a rapid rise in
electronics, we must work together as an industry to enable this critical transformation.

In her keynote, Dipti will discuss the holistic approach required to deliver these vehicles of the future and the investments required in hardware, software, and industry collaborations to make this vision a reality.

 

Thursday Keynote

Scott Runner

CEO, CARIAD Inc

Title: Is it Safe to Pass?  Challenges & Solutions to Healthy Vehicles

Biography:  Scott Runner has more than 30 years of software, hardware, and semiconductor experience in the global automotive and mobile communications industries. He also has extensive leadership experience in digital and cultural transformation.

Runner began his career in 1985 at Fujitsu with subsequent positions at Synopsys, Conexant, and a start-up company consulting to ARM Ltd. In 2003, Runner joined Qualcomm to help build the US and India teams and methods that delivered the first and subsequent integrated smartphone SoCs. In 2012, Runner helped found the team that delivered Qualcomm’s first two generations of automotive-grade infotainment and telematics products. Subsequently, Runner joined what became Capgemini Engineering as the Global Practice Leader for embedded software, EE, and semiconductors responsible for consulting, solutioning, developing, validating, and testing of in-vehicle infotainment, ADAS/AD and telematics products and systems for OEM and tier1 clients. Scott is currently the CEO for CARIAD, Inc., where he leads a team focusing on hardware development, cloud technologies, and connected infotainment for Volkswagen Group Brands. He has a B.S. in applied physics and did graduate work in computer science and engineering management.