ITC 2016 Panels

Monday, 4:45 p.m. – 6:30 p.m.
PANEL 1 The Unknown Unknowns in Test
R. Aitken, ARM (Moderator), W. Eklow, (Organizer)
This panel panel will explore the mysteries of unknowns in test. Unknowns are often why we end up solving a wrong problem, taking a wrong strategy, interpreting a result wrongly, all of which can hinder us from performing effective testing. This panel will uncover some of the unknowns and discuss what (if any) we can do to contain the risk from unknowns in test.
A social reception will be held at 6:30 p.m. following Panel 1.

Tuesday, 4:30 a.m. – 6:00 p.m.
PANEL 2 Phased Array 5G: Is Test Connected or Disconnected?
M. Slamani, GLOBALFOUNDRIES (Organizer)

The need for 1000x increase in mobile data rate led to a push for an evolution of wireless networks and a revolution in architecture to meet future demands. The current architecture needs some major changes to keep up with future data needs. Test methods and processes need to evolve to match the new 5G requirements in order to provide a high confidence to operators that the technology and services are implemented according to specification. This panel will highlight the 5G test challenges and explore possible future solutions to enable mass market production.
Panelists P. Cain, Keysight • B. Floyd, North Carolina State University • R. McAleenan, Advantest • A. Roessler, Rohde & Schwarz • M. Roos, Roos Instruments

PANEL 3 Test Cost Reduction—Is There More to Cut?
H. Kobayashi, Gunma University (Moderator and Organizer)
LSI testing is not just technology, but also it is a part of company management strategies. For example, some companies may use low cost ATE while others may use high-end mixed-signal ATEs as well as its associated services and know how. It also depends on applications of the DUT; for automotive application ICs, reliability and safety are very important and sufficient testing is required. The figure of merit for LSI testing may be test quality / test cost. In this panel, several possible LSI testing methods in terms of test cost reduction will be discussed.
Panelists R.Bartlett, Advantest • W. Dobbelaere, ON Semiconductor • R.Knoth, Cadence • R. van Rijsinge, NXP Semiconductors • P. Sarson, ams

Thursday, 1:30 p.m. – 3:00 p.m.
PANEL 4 ATE Revisited–Where Are We Today and Where Should We Be Heading?
B. Parnas, Amat (Moderator and Organizer)
Every few years industry trends drive changes in the requirements for test equipment. This panel will look at trends in the last five years and the impact on ATE as well as look into the future.
Panelists P. Berndt, Cypress Semiconductor • B. Bogie, XCerra • H. Engelhard, Advantest • K. Lanier, Teradyne

PANEL 5 Test, Validation and Security for IoTs
M. Tehranipoor, University of Florida (Moderator and Organizer)
IoTs are expected to be pervasive in home, businesses, smart communities and cities. IoT devices are now found in commonplace amenities such as cars, phones, watches, appliances, home and business security systems,  thermostats, smoke detectors, as well as applications such as utilities, banking, transportation, energy, and (bio)medical industry. The number of devices introduced in the market as IoT has increased drastically, with an estimated 50 billion by 2020, most of which are expected to be fabricated off-shore. The panel discusses the challenges that come with such large scale growth.
Panelists Y. Iskandar, Cisco Systems • Y. Kiki, Optimal+ • M. Vai, MIT Lincoln Lab • Y. Zorian, Synopsys

This panel panel will explore the mysteries of unknowns in test. Unknowns are often why we end up solving a wrong problem, taking a wrong strategy, interpreting a result wrongly, all of which can hinder us from performing effective testing. This panel will uncover some of the unknowns and discuss what (if any) we can do to contain the risk from unknowns in test. A social reception will be held at 6:30 p.m. following Panel 1.

Tuesday, 4:30 p.m. – 6:00 p.m.
PANEL 2 Phased Array 5G: Is Test Connected or Disconnected?
M. Slamani, GLOBALFOUNDRIES (Organizer)

The need for 1000x increase in mobile data rate led to a push for an evolution of wireless networks and a revolution in architecture to meet future demands. The current architecture needs some major changes to keep up with future data needs. Test methods and processes need to evolve to match the new 5G requirements in order to provide a high confidence to operators that the technology and services are implemented according to specification. This panel will highlight the 5G test challenges and explore possible future solutions to enable mass market production.
Panelists P. Cain, Keysight • B. Floyd, North Carolina State University • R. McAleenan, Advantest • A. Roessler, Rohde & Schwarz • M. Roos, Roos Instruments

PANEL 3 Test Cost Reduction—Is There More to Cut?
H. Kobayashi, Gunma University (Moderator and Organizer)

LSI testing is not just technology, but also it is a part of company management strategies. For example, some companies may use low cost ATE while others may use high-end mixed-signal ATEs as well as its associated services and know how. It also depends on applications of the DUT; for automotive application ICs, reliability and safety are very important and sufficient testing is required. The figure of merit for LSI testing may be test quality / test cost. In this panel, several possible LSI testing methods in terms of test cost reduction will be discussed.
Panelists R.Bartlett, Advantest • W. Dobbelaere, ON Semiconductor • R.Knoth, Cadence • R. van Rijsinge, NXP Semiconductors • P. Sarson, ams

Thursday, 1:30 p.m. – 3:00 p.m.
PANEL 4 ATE Revisited–Where Are We Today and Where Should We Be Heading?
B. Parnas, Amat (Moderator and Organizer)

Every few years industry trends drive changes in the requirements for test equipment. This panel will look at trends in the last five years and the impact on ATE as well as look into the future.
Panelists P. Berndt, Cypress Semiconductor • B. Bogie, XCerra • H. Engelhard, Advantest • K. Lanier, Teradyne

PANEL 5 Test, Validation and Security for IoTs M.
Tehranipoor, University of Florida (Moderator and Organizer)

IoTs are expected to be pervasive in home, businesses, smart communities and cities. IoT devices are now found in commonplace amenities such as cars, phones, watches, appliances, home and business security systems, thermostats, smoke detectors, as well as applications such as utilities, banking, transportation, energy, and (bio)medical industry. The number of devices introduced in the market as IoT has increased drastically, with an estimated 50 billion by 2020, most of which are expected to be fabricated off-shore. The panel discusses the challenges that come with such large scale growth.
Panelists Y. Iskandar, Cisco Systems • Y. Kiki, Optimal+ • M. Vai, MIT Lincoln Lab • Y. Zorian, Synopsys