After a four-year break, the 3D-TEST Workshop is back! Well aware of which technical topics are “hot” today, we have expanded the scope of the workshop to include testing of chiplet-based ICs, as this has a very natural fit with the existing focus. This addition caused the workshop acronym to grow from 3D-TEST to 3DC-TEST: the 7th IEEE International Workshop on Testing Three-Dimensional, Chiplet-Based, and Stacked ICs. The workshop will take place as a virtual event, in conjunction with and starting immediately after ITC, on Thursday November 5 and finish on Friday November 6, 2020 – just like the previous editions. The program has been defined, registration is open, and everyone who is interested in these topics is welcome to join; for more information see the workshop’s website; http://3dtest.tttc-events.org. At this website, you can also find the archives of the previous workshop editions.
To whet your appetite, this video gives an impression of the previous six editions of this successful workshop. Enjoy!
http://www.itctestweek.org/wp-content/uploads/2021/01/2021-banner.png00Ron Presshttp://www.itctestweek.org/wp-content/uploads/2021/01/2021-banner.pngRon Press2020-10-21 17:22:142020-10-25 20:45:443D-TEST Workshop is back